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2SK3398
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (-MOSV)
2SK3398
Switching Regulator and DC-DC Converter Applications Motor Drive Applications
* * * * Low drain-source ON resistance: RDS (ON) = 0.4 m (typ.) High forward transfer admittance: |Yfs| = 9.0 S (typ.) Low leakage current: IDSS = 100 A (max) (VDS = 500 V) Enhancement-mode: Vth = 2.0 to 4.0 V (VDS = 10 V, ID = 1 mA) Unit: mm
Absolute Maximum Ratings (Ta = 25C)
Characteristics Drain-source voltage Drain-gate voltage (RGS = 20 k) Gate-source voltage Drain current DC (Note 1) Symbol VDSS VDGR VGSS ID IDP PD EAS IAR EAR Tch Tstg Rating 500 500 30 12 48 100 364 12 10 150 -55 to150 Unit V V V A W mJ A mJ C C
Pulse (Note 1)
Drain power dissipation (Tc = 25C) Single pulse avalanche energy (Note 2) Avalanche current Repetitive avalanche energy (Note 3) Channel temperature Storage temperature range
JEDEC JEITA TOSHIBA
SC-97 2-9F1B
Weight: 0.74 g (typ.)
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
Thermal Characteristics
Characteristics Thermal resistance, channel to case Symbol Rth (ch-c) Max 1.25 Unit C/W
Circuit Configuration
4
1
Note 1: Ensure that the channel temperature does not exceed 150C. Note 2: VDD = 90 V, Tch = 25C (initial), L = 5.85 mH, RG = 25 , IAR = 12 A Note 3: Repetitive rating: pulse width limited by maximum channel temperature This transistor is an electrostatic-sensitive device. Please handle with caution.
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2SK3398
Electrical Characteristics (Ta = 25C)
Characteristics Gate leakage current Drain-source breakdown voltage Drain cut-OFF current Drain-source breakdown voltage Gate threshold voltage Drain-source ON resistance Forward transfer admittance Input capacitance Reverse transfer capacitance Output capacitance Rise time Turn-ON time Switching time Fall time Turn-OFF time Total gate charge (gate-source plus gate-drain) Gate-source charge Gate-drain ("miller") charge tf toff Qg Qgs Qgd VDD 400 V, VGS = 10 V, ID = 10 A - Duty < 1%, tw = 10 s = VDD 200 V - Symbol IGSS V (BR) GSS IDSS V (BR) DSS Vth RDS (ON) Yfs Ciss Crss Coss tr ton 10 V VGS 0V 50 ID = 6 A VOUT VDS = 10 V, VGS = 0 V, f = 1 MHz Test Condition VGS = 25 V, VDS = 0 V IG = 10 A, VDS = 0 V VDS = 500 V, VGS = 0 V ID = 10 mA, VGS = 0 V VDS = 10 V, ID = 1 mA VGS = 10 V, ID = 6 A VDS = 10 V, ID = 6 A Min 30 500 2.0 4.0 Typ. 0.4 9.0 2040 200 630 22 58 36 180 45 25 20 Max 10 100 4.0 0.52 ns nC pF Unit A V A V V S
RL = 33
Source-Drain Ratings and Characteristics (Ta = 25C)
Characteristics Continuous drain reverse current (Note 1) Pulse drain reverse current Forward voltage (diode) Reverse recovery time Reverse recovery charge (Note 1) Symbol IDR IDRP VDSF trr Qrr Test Condition IDR = 12 A, VGS = 0 V IDR = 12 A, VGS = 0 V, dIDR/dt = 100 A/s Min Typ. 1200 16 Max 12 48 -1.7 Unit A A V ns C
Marking
Part No. (or abbreviation code)
K3398
Lot No. A line indicates lead (Pb)-free package or lead (Pb)-free finish.
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ID - VDS
12 Common source 10 Tc = 25C pulse test 24 10 15 6 5.2 5 20 10 15 6.0
ID - VDS
Common source 5.5 5.75 16 5.2 12 5.0 4.75 4.5 Tc = 25C pulse test
Drain current ID (A)
8 4.75 6
4
4.5
Drain current ID (A)
8
2
4.25 VGS = 4 V
4 VGS = 4.0 V 10 0 0 10 20 30 40 50 60
0
0
2
4
6
8
Drain-source voltage
VDS (V)
Drain-source voltage
VDS (V)
ID - VGS
24 Common source pulse test VDS = 20 V 12
VDS - VGS
Common source Tc = 25C pulse test
Drain current ID (A)
VDS (V) Drain-source voltage
20
10
16
8
12
6
ID = 12 A
8 100 4 25 Tc = -55C
4 6 2 3
0 0
2
4
6
8
10
12
0 0
4
8
12
16
20
24
Gate-source voltage
VGS (V)
Gate-source voltage
VGS (V)
Yfs - ID
(S)
30 Common source 10 Pulse test 5 3 VDS = 20 V 10 Common source 5 Tc = 25C Pulse test 3
RDS (ON) - ID
Forward transfer admittance Yfs
100 25
Drain-source on resistance
Tc = -55C
RDS (ON)
()
1 0.5 0.3 VGS = 10, 15 V 0.1 0.1
1 0.5 0.3 0.1 0.3 0.5 1 3 5 10 30
0.3 0.5
1
3
5
10
30
Drain current ID (A)
Drain current ID (A)
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RDS (ON) - Tc
()
2.5 Common source VGS = 10 V pulse test 100 Common source Tc = 25C 30 pulse test
IDR - VDS
Drain-source on resistance RDS (ON)
2.0
Drain reverse current IDR
(A)
ID = 12 A
10
1.5
3 10 5 3 1 -0.6 -0.8 -1.0 -1.2
1.0 3 0.5 6
1 0.3
VGS = 1 V 0 -80 -40 0 40 80 160 0.1 0 -0.2 -0.4
Case temperature
Tc (C)
Drain-source voltage
VDS (V)
Capacitance - VDS
5000 3000 5 Ciss
Vth - Tc
Common source VDS = 10 V ID = 1 mA pulse test
Vth (V) Gate threshold voltage
4
(pF)
1000 500 300 Coss 100 50 30 Common source VGS = 0 V f = 1 MHz Tc = 25C 0.3 0.5 1 3 5 10 Crss
Capacitance C
3
2
1
10 0.1
30 50
100
0 -80
-40
0
40
80
120
160
Drain-source voltage
VDS (V)
Case temperature Tc (C)
PD - Tc
50 600
Dynamic input/output characteristics
Common source ID = 12 A Tc = 25C pulse test VDS VDD = 80 V 300 400 200 8 200 12 24
Drain power dissipation PD (W)
VDS (V)
40
500
20
400
16
20
10
Drain-source voltage
100
VGS
6
0 0
40
80
120
160
200
0 0
10
20
30
40
50
0 60
Case temperature
Tc (C)
Total gate charge Qg (nC)
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Gate-source voltage
30
VGS (V)
2SK3398
rth - tw
3
Normalized transient thermal impedance rth (t)/Rth (ch-c)
1 Duty = 0.5 0.3 0.2 0.1 0.05 0.02 0.03 0.01 Single Pulse PDM t T Duty = t/T Rth (ch-c) = 1.25C/W 100 1m 10 m 100 m 1 10
0.1
0.01
0.003 10
Pulse width
tw
(S)
Safe operating area
100 50 30 ID max (continuous) 10 ID max (pulsed) * 500
EAS - Tch
Avalanche energy EAS (mJ)
100 s *
400
Drain current ID (A)
5 3
1 ms *
300
200
1 0.5 0.3
DC operation Tc = 25C
100
0 25 0.1 0.05 *: Single nonrepetitive pulse Tc = 25C 0.03 Curves must be derated linearly with increase in temperature. 0.01 10 1 VDSS max 100 1000
50
75
100
125
150
Channel temperature (initial) Tch (C)
15 V -15 V
BVDSS IAR VDD VDS
Drain-source voltage
VDS (V)
Test circuit
RG = 25 VDD = 90 V, L = 4.3 mH
Wave form
AS =
1 B VDSS L I2 B 2 VDSS - VDD
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RESTRICTIONS ON PRODUCT USE
* The information contained herein is subject to change without notice.
20070701-EN
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer's own risk. * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. * Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.
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